EPR Studies on Defect Production and lts Annealing Behavior in Silicon After High Fluence Ar lon lrradiation
- Received Date: 1900-01-01
- Accepted Date: 1900-01-01
- Available Online: 1998-07-05
Abstract: Silicon samples were irradiated below 50K with 1 12MeV Ar ions to a fluence of 8×1014/cm2. Defect production and its isochronal annealing behavior have been investigated at room temperature by Electron Paramagnetic Resonance technique. Neutral 4-vacancy (Si-P3 center), positively charged 〈100〉 splitted di-interstitial (Si-P6 center) and the contiuous amorphous layer have been detected in the as-irradiated sample. At an annealing temperature of 200℃ , the Si-P3 and Si-P6 centers were annealed out and five vacancy cluster in negative charge state (Si-P1 center) began to grow. The Si-P1 center disappeared at about 550℃. For the temperature above 350℃, Si-A11 center (a center may include several vacancies) has been observed, which was stable up to 550℃, The temperatue for recrystallization of the continuous amorphous layer is higher than 600℃. During the annealing process, the line shape and line width for amorphous center were not changed. The results are qualitatively discussed.





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